San Diego
Managing Quality and Reliability Issues for Semiconductor Packaging. Link
San Diego
Every organization — from startups to global enterprises — encounters problems that disrupt operations or damage reputation. Some are quickly resolved. Others spiral out of control becoming costly crises that shake customer trust and organizational morale. Why do some issues escalate while others are swiftly neutralized? The answer lies not in luck, but in discipline and a structured methodology.

Issues are inevitable and of varying risks, especially in high volume manufacturing. Addressing them promptly minimizes disruption and damage. Resolving mistakes requires a structured approach that is necessary in high-stakes environments where product quality, customer trust, and operational efficiency must be safeguarded at all costs. The course teaches a practical framework on managing and resolving issues before they become crisis.

Zero Defect Manufacturing (ZDM) is emerging as a strategic imperative for semiconductor industry. Hence managing Q&R issues with utmost attention is vital. Such issues arise with or without warnings whether they are contamination related, equipment malfunctions, process variabilities, out of spec material, customer variability or just human errors. Tackling them requires an approach that focuses on prompt resolution with effective problem solving and future prevention with effective learning.

This interactive workshop provides a hands-on approach to managing critical issues efficiently by using a framework developed from instructors' combined 50+ years experience in the semiconductor industry. It covers the why, how and what of issue management with real case studies. The workshop emphasizes the need for an organized framework for operational excellence, brand protection and company profitability.
Engineering professionals need a practical foundation in quality and reliability principles essential for product success across development, manufacturing, and field operation.

This course utilizes proven methodologies to assess quality and reliability of any complex system. This includes understanding system use conditions, mapping failure mechanisms with FMEA, stress testing to get insightful data on observed failure modes, optimizing system design for reliability, characterizing failure mechanisms, building statistics and physics-based models and predicting Q&R metrics over the useful life of the product.

There is growing demand for advanced heterogeneously integrated packages that support functionally rich, data-intensive, and power-hungry chips. The packaging must consistently deliver exceptional quality and reliability. This course introduces proven methodologies - such as Design for Reliability (DfR), process/ design FMEA, accelerated testing, physics-based reliability models - that address packaging failure mechanisms encountered during product’s useful life.

This course in reliability statistics covers design of experiments, life distribution analysis, acceleration models, parameter estimation, parametric regression, Bayesian methods, and sample size determination. It equips professionals to analyze failure data, model reliability, and optimize testing strategies. Ideal for engineers and analysts seeking to enhance product performance, predict failures, and apply statistical rigor in reliability engineering.
These courses can be delivered on site or virtually based on customer preferences. We recommend courses/ workshops with hands-on learning to be on site.
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